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发明名称
GOLD PLATING REMOVAL JIG AND REMOVAL METHOD FOR LEAD OF LSI PACKAGE
摘要
申请公布号
JPH04287957(A)
申请公布日期
1992.10.13
申请号
JP19910000362
申请日期
1991.01.08
申请人
NEC CORP
发明人
IIIZUMI TAMIO
分类号
H01L23/50
主分类号
H01L23/50
代理机构
代理人
主权项
地址
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