| 摘要 |
- i PATENT APPLICATION OF WAYNE EDMUND FEELY FOR MICROPLASTIC STRUCTURES AND METHOD OF MANUFACTURE DN 85-04 MSA/sds of the Invention Thermally stable microplastic structures and methods for their manufacture are provided. The microplastic structures are prepared from crosslinkable photosensitive compositions using a specially designed radiation attenuating photomask which permits preselection of the size, length, width and thickness of the desired structure. The microplastic structures are stable at temperatures in excess of 200.degree.C and can be used as components in miniature electrical, mechanical, chemical and optical devices, such as smart sensors integral to a silicon chip device. Related Applications The present invention is related to my Canadian patent application Serial No. 482,900, filed in the Canadian Patent Office on May 31, 1985, entitled "Thermally Stable Polymer Images and Processes", now Canadian Patent No. 1,283,799, granted May 7, 1991. The invention is also related to my copending Canadian patent application entitled "Photosensitive Compounds and Thermally Stable and Aqueously Developable Negative Images" filed in the Canadian Patent Office on December 30, 1986 under Serial No. 526,483. |
