| 摘要 |
1,011,280. Packaging. MOSAIC TILE CO. April 17, 1964 [April 17, 1963], No. 16032/64. Heading B8C. [Also in Division B6] Individual tiles or similar pieces are joined together to form a connected assembly by grouping a number of tiles in the required spaced relationship so that the spaces therebetween constitute a predetermined pattern, depositing upon a planar surface a number of spots of settable resin so that the spots lie at spaced points of an identical pattern, lifting the group of tiles and placing it above the resin spots with the two patterns in register, and pressing the group on to the resin spots so that the tiles are bridged and connected by the resin spots. The group of tiles is assembled on a board 301, Fig. 2, which has longitudinal and transverse metal strips forming pockets to receive the tiles and, as shown, accommodates 12 x 24 tiles. The board is situated at one side of a conveyer 100 upon which the spots of adhesive 201 are deposited by apparatus 200. As described, the apparatus 200 applies four transverse lines of twenty-five spots, each so that the conveyer 100 has to be stepped rightwardly twice after the first application and a further application of spots made after each step in order that sufficient spots may be deposited to connect the group of tiles assembled on the board 301. When by forward movement of the conveyer 100 a complete group of resin spots is adjacent to the board 301, the group C of tiles is lifted off the board 301, moved transversely to the conveyer until the group patterns register, and then moved downwardly and pressed against the spots. Beyond the board 301 the assembly passes through a resin-curing station 600, Fig. 1 (not shown), comprising infra-red heating lamps, and a cooler. The resin spots may join together a series of groups A, B, C, each constructed as described so as to form a long length of connected tiles. The movement of the conveyer 100 by a gripper device, the operation of the resin-applying apparatus and the actuation of the devices for transporting a group of tiles such as C on to the conveyer are all effected by pneumatic piston-and-cylinder mechanism controlled by electric circuitry or manually. The resin-depositing apparatus 200 comprises a frame 206, Fig. 6, movable vertically by a piston-and-cylinder 233 and carrying at its lower end the spot-applying nozzles 210. Pumps 205 supplying the nozzles are mounted in the frame 206 and each is connected to a resin manifold-pipe 229 and to a pneumatic manifold-pipe 231. Individual nozzles may be opened or closed according to the size of the tiles employed. A vacuum block 247 is situated below the conveyer where the resin is applied and is actuated to cause the underside of the conveyer 100 to be drawn against the flat top of the block 247 whilst the spots are being applied. The apparatus for transferring the tiles to the conveyer 100 comprises a table 306, Fig. 7, upon which the board 301 is placed, and a carriage 327 reciprocated between the table 306 and the conveyer 100 by a piston-andcylinder 340, 338. Mounted on the carriage is a hollow platen 328 movable vertically by a piston-and-cylinder 336. The bottom plate of the platen has apertures aligned with the centres of the tiles. In operation, the platen 328 is moved downwardly into contact with a group of tiles on the board 301, vacuum is applied to the platen interior so as to cause the tiles to adhere to the platen, and the platen is then raised. The carriage 327 is now moved over the conveyer 100 and the platen lowered to deposit the tiles upon the conveyer. If the platen fails to pick up a complete group of tiles, the drop in the vacuum in the platen may be utilized to operate an alarm device and to actuate a control which prevents the incomplete group of tiles being deposited on to the conveyer 100. Specifications 989,791 and 989,792 are referred to. |
