发明名称 MOISTURE-CURING HOT-MELT ADHESIVE
摘要 A moisture-curing hot-melt adhesive comprises (A) a urethane prepolymer comprising hard and soft segment moieties and having an isocyanate group at the terminus which is prepared by reacting stepwise a polyol having a molecular weight of 1,000 to 8,000 and a thermoplastic saturated polyester polyol having a molecular weight of 1,000 to 6,000, a melting point of 50 DEG C. or higher and a glass transition temperature of 10 DEG C. or higher with an diisocyanate compound in a overall NCO/OH ratio of 1.6 to 3.0, and (B) a urethane prepolymer comprising a soft segment moiety and having an isocyanate group at the terminus which is prepared by reacting a polyol having a molecular weight of not more than 8,000 with a diisocyanate compound in an NCO/OH ratio of 1.6 to 3.0, said component (A) and component (B) being mixed in a ratio of 10:90 to 90:10 by weight. Said adhesive has excellent adhesion and pressure-sensitive adhesion and initial properties and is suitable for adhering various parts in automobile industry and construction industry.
申请公布号 US5155180(A) 申请公布日期 1992.10.13
申请号 US19900557778 申请日期 1990.07.26
申请人 SUNSTAR GIKEN KABUSHIKI KAISHA 发明人 TAKADA, MASAHARU;UEDA, RYUICHI;SUGIMORI, MASARU
分类号 C08L75/04;C08G18/10;C08G18/12;C08L75/00;C09J175/00;C09J175/04 主分类号 C08L75/04
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