| 摘要 |
PURPOSE:To enable the bonding of a thermoplastic tricyclodecane resin excellent in strength and heat resistance by using an adhesive prepared by dissolving the same resin in an organic solvent. CONSTITUTION:A process for bonding a thermoplastic tricyclodecane resin, e.g. a ring-opening (co)polymer of a monomer of the formula (wherein A and B are each H or 1-10C hydrocarbyl; X and Y are each H, halogen or a monovalent organic group; and n is 0 or 1) and/or its hydroganated derivative, wherein an adhesive prepared by dissolving the same resin in an organic solvent is used. According to the above process, the bonding strength to the tricycclodecane resin is excellent and so in the heat resistance. Thus it is possible to bond an optical disc, an electircal appliance, a roofing mateiral, an automobile head lamp or an automatic tail lamp cover, each made from this resin, effectively. |
