HYBRID INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE:To obtain a hybrid integrated circuit device where electronic components such as a semiconductor element and the like which release heat can be mounted high in degree of integration and kept high in stability. CONSTITUTION:Circuit boards 1a and 1b mounted with semiconductor elements 3 which release heat are made to protrude in directions opposite to each other respectively and pasted on the sides of a heat dissipating plate 8 with adhesive agent 6. The edges of the circuit boards 1a and 1b protruding from the heat dissipating plate 8 are pinched by F-type clip leads 9, an assembly composed of the heat dissipating plate 8 and the circuit boards 1a and 1b is supported on a primary circuit board, and the semiconductor elements 3 are electrically connected to the outside by the F-type clip leads 9.