| 摘要 |
<p>PURPOSE:To reduce the interval of outer leads for an IC, and realize high density packaging. CONSTITUTION:A plurality of outer leads 31, 32 for an IC are turned into pairs of every two leads, which are stacked via insulator 40. The leads of each pair are vertically bent. End portions of the vertical parts 31b, 32b are bent so as to open to each other, thereby forming a soldering part. As compared with an IC package having the same external size as conventional one, the twofold number of leads can be arranged, and the packaging density can be increased by that amount. The area on the printed wiring board surface occupied by the outer leads can also reduced. Productivity also is excellent.</p> |
