| 摘要 |
PURPOSE:To form an electrolytic solder plated layer of a uniform thickness by forming a solder plated layer on the entire surface of a printed wiring board after a panel copper plated layer is formed by electroless copper plating and electrolytic copper plating methods. CONSTITUTION:A panel copper plated layer 7 composed of an electroless copper plated layer 5 and electrolytic copper plated layer 6 is formed on a multilayered substrate 3 by electroless copper plating and electrolytic copper plating processes. Then a solder plated layer 7 is formed on the entire surface of the substrate 3 by an electrolytic solder plating process and a resist pattern 8 having a prescribed shape is formed by exposing and developing a photoresist film which is used as a mask at the time of etching the solder plated layer 11. After forming the pattern 8, the layer 11 is etched to have a prescribed pattern by using the pattern 8 as a mask. |
