| 摘要 |
PURPOSE:To simultaneously realize a high speed transmission and high density miniature interconnection by forming miniature multilayer interconnections by using a ceramic composition having low permittivity and in which low temperature sintering can be performed. CONSTITUTION:When a conductor is formed in the case of manufacturing a low permittivity hybrid multilayer ceramic wiring board, 2-layer films 10, 11 of Ti and Pd are first adhered by sputtering, coated with photoresist 12, exposed, developed and formed with a mask pattern. On the other hand, when an insulating layer is formed, photoset insulating layer paste 14 is screen printed, dried on Au interconnection 13, a viahole pattern is exposed and developed by using a mask 15. Further, conductor paste is buried to be supplemented in the viahole. Thereafter, an insulating layer 17 having a viahole 16 is formed by firing. Further, in order to form multilayer interconnections, a conductor forming process and an insulating layer process are repeated. A chip mounting top metal layer is formed, and several LSI chips are placed thereon. |
