| 摘要 |
PURPOSE:To protect a flexible beam against damage while a semiconductor dynamic sensor of high sensitivity is manufactured so as to enable the dynamic quantity sensor to be enhanced in yield and lessened in cost by a method wherein the flexible beam is formed first, then a stopper is provided, and then a weight is formed on the flexible beam. CONSTITUTION:A structure provided with only a flexible beam 25a with no weight is formed first, stoppers 22 and 23 are formed adjacent to (for instance, above and below) the flexible beam 25a, then a weight 26 is provided to a part of the flexible beam 25a through metal plating. Therefore, manufacturing processes are finished up to a stopper forming process keeping a sensor in a state where it is low in sensitivity or a flexible beam is hardly broken, so that the sensor concerned is prevented from deteriorating in yield due to the damage of the flexible beam while it is manufactured, and stoppers are easily formed to enable the sensor to be lessened in manufacturing cost. |
