MANUFACTURE OF FILM CARRIER

摘要

PURPOSE:To ensure superior connection at the time of semiconductor element mounting, by erasing cutter marks (note: uneven flaws caused by working) formed on the surface of a metal conductor layer of an aperture part formed on a two-layered structure film carrier by cutting and eliminating an organic insulating film left in recessed parts on a bonded surface of the metal conductor layer and the organic insulating layer. CONSTITUTION:The manufacturing method of a film carrier wherein an aperture part 3 such as a lead hole and a positioning hole formed, by cutting on a two- layered structure film carrier composed of a metal conductor layer 1 and an organic insulating layer 2 is subjected to chemical polishing.