| 摘要 |
PURPOSE:To form the titled element containing polythienylene as the material for said element by a method wherein a resin film containing particle form polythienylene in a dispersed state is provided on a conductive substrate electrode. CONSTITUTION:The binder resin film 2 contains and holds the poly particles 1 of dispersed state. This film is formed by coating the conductive substrate electrode wherein a conductive film electrode 4 is formed on a glass substrate 5 with homogenous slurry wherein the mixture of binder resin material with polythienylene is dissolved with a solvent, and vacuum-drying it. A semi-transparent metallic thin film electrode 3 is formed on the film 2 by vapor deposition. A lead wire 7 joined by means of silver paste 6 and 6' is connected to the electrodes 3 and 4. |
