| 摘要 |
PURPOSE:To enable a multilayer wiring board where a metal film is formed on the inner wall of a through-hole or a viahole through an evaporation method to be manufactured. CONSTITUTION:An argon atmosphere is produced inside the through-hole or a viahole of a wiring board where a metal film is evaporated, whereby evaporated atoms are made to easily enter the through-hole or the viahole. In result, an evaporation film is formed on all the inner face of the through-hole or the viahole. (1): a film can be evaporated on all the inner surface of a through-hole. (2): usually, a wiring layer is formed through an evaporation method, but a metal film is formed on the inner wall of a through-hole or a viahole through an electroless plating method, because it can not be formed through an evaporation method, so that two processes are required and consequently the board concerned is increased in processing cost. By this setup, the formation of a wiring layer and the formation of metal film on the inner wall of a through-hole or a viahole are carried out at the same time, so that the board of this design can be enhanced in productivity and lessened in processing cost. |
