| 摘要 |
PURPOSE:To provide the bonding structure of a semiconductor device, which is superior in moisture resistance, and the method of manufacturing the bonding structure. CONSTITUTION:First and second sidewalls (21 and 22) are formed on the sides of bonding pads (3 and 4) and first and second passivation films (11 and 12) are provided in such a way as to cover those first and second sidewalls (21 and 22). Thereby, the thicknesses of the passivation films (11 and 12) are effectively increased and water content is prevented from intruding from the outside. |
