COPPER FOIL FOR INNER LAYER CIRCUIT OF MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURE THEREOF

摘要

PURPOSE:To enhance adhesive properties with a prepreg, to scarcely cause a haloing and to further facilitate an optical inspection. CONSTITUTION:A copper foil for an inner layer circuit of a multilayer printed circuit board comprising a black metal-plated layer further provided at least on a rough surface as a front surface of the inner layer circuit board of the foil in which both side surfaces are previously roughed.