发明名称 CERAMIC PACKAGE
摘要 PURPOSE:To solve directionality in brazing strength while facilitating the alignment of the lead end parts at the brazing part of a package by a method wherein at least a part of the bottom surface of a stepped part formed on the nearby part of the end of the package is composed of the brazing part. CONSTITUTION:At least a part of the bottom surface of a stepped part 20 formed on the nearby part of the end of a ceramic package 10 is composed of the brazing part 18 comprising a metallized layer formed of a conductor such as tungsten, etc., to be formed into one body in the brazing part 18 on the bottom surface of the stepped part 20 while the end of a lead 12 is brazed onto the brazing part 18 extending over the nearby part of the outer periphery of the stepped part 20. Next, a solder 16 is filled up to be set so that a recessed meniscus may be formed on the surface of the solder 16 by the contact between the solder 16 and the lead 12 main body and the brazing part 18 on the bottom surface of the stepped part 20 at least in a part of the cavity between the lead main body 12 and the brazing part 18 comprising the bottom surface of the stepped part 20.
申请公布号 JPH04284651(A) 申请公布日期 1992.10.09
申请号 JP19910074106 申请日期 1991.03.13
申请人 SHINKO ELECTRIC IND CO LTD 发明人 KOBAYASHI HIROYUKI
分类号 H01L23/08;H01L23/04;H01L23/12;H01L23/48;H01L23/50 主分类号 H01L23/08
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