| 摘要 |
PURPOSE:To ensure high density packaging by mounting a bypass capacitor on a package of an integrated circuit itself. CONSTITUTION:A ceramic plate 1 is coated with a metallized layer 2 for ground, on which an integrated circuit chip 3 is fixed, and lead pins 4, 5 penetrate from the inside of a package to the outside. On the upper plate of the package another metallized layer 7 for ground and a metallized layer 8 for a power supply are provided to shield the integrated circuit chip 3, and on the upper surface of the package pads 10, 11 are provided. The ground pad 11 is connected with the metallized layers 8, 2 for ground and the lead pin 3 for ground through a longitudinal via hole 12, and the pad 10 for a power supply is connected with the metallized layer 8 for a power supply and the lead pin 4 for a power supply through a via hole 13. Further, a chip capacitor 9 is mounted on the pads 10, 11 on the upper surface of the package. |
