| 摘要 |
<p>PURPOSE:To lessen the number of processes and to control the height of a solder bump easily by forming the bump by dipping a board having an opening in a bath of molten solder, without using a plating method. CONSTITUTION:A bonding pad 11 is formed on a base 10, a protective layer 12 is formed in a film thickness being equal to a desired height of a solder bump on the base and an opening 14 is formed in the desired height of the solder bump on the bonding pad 11. A board 21 prepared by forming a barrier metal 15 on the bonding pad 11 is dipped in molten solder 32. On the occasion when the board 21 is drawn up from a solder bath, excessive solder sticking to a part other than the opening 14 on the bonding pad 11 is removed. Then, the protective film 12 is etched all over the surface, and the desired height of the solder bump 17 is obtained according to the amount of etching of the protective film 12.</p> |
