| 摘要 |
An electrical overstress composite of conductor/semiconductor particles including particles 21, 22 and 23 in the 100 micron range, micron range, and submicron range, distributed in a densely packed homogeneous manner, a minimum proportion of 100 angstrom range insulative particles 24 separating the conductor/semiconductor particles 21, 22 and 23, and a minimum proportion of insulative binder matrix 25 sufficient to combine said particles into a stable coherent body. |
