| 摘要 |
A LED exposure head for use in a recording device for linewise recording information on a moving photoconductor, which comprises a metal base plate (38) onto which are mounted a row of LED dice (39) along the centre, rows of integrated circuit chips (41, 42) and printed circuit boards (43, 44) outside of such rows of integrated circuit chips, and optical imaging means (30) for focussing the image of the LED's in the image plane of the photoconductor. The base plate has a raised rib (52) for mounting the LED dice at a height above the base which is such that their electric bonding pads (53, 54) are at a level above that of the corresponding bonding pads (55, 56) of the integrated circuit chips (41, 42). <IMAGE>
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