| 摘要 |
<p>An apparatus and method by which a flat film-type resistor (10) is intentionally caused to thermal-shock fracture (Fig. 1) in response to a predetermined high-voltage overload condition. The resistor includes flat film-type resistor coatings (28,29) connected to traces (16,18,52). A stressed spring wire (71,72) is mounted on such film-type resistor and connected in circuit with it. A predetermined solder (76) and temperature gradient are employed to hold the spring wire in bent condition until the solder (76) melts, whereupon the spring (71,72) flexes and the circuit breaks. Heatsink portions (43-46) are provided in the circuit board for such resistor and receive pins (33-40) thereof. <IMAGE></p> |
