| 摘要 |
<p>PURPOSE:To improve a manufacturing yield and reliability by incorporating an integrated circuit chip secured to a die stage of a lead frame via an adhesive layer and interposing means provided between the chip and a periphery of the state to increase thickness of the layer between the chip and the stage. CONSTITUTION:A peripheral edge of a die stage 1 of a lead frame is bent to a surface side for placing an integrated circuit chip 2. Thus, thickness of an adhesive layer 3 for securing the chip 2 to the stage 1 is increased as compared with that of prior art, and a thermal stress alleviating effect is improved. Thus, a wire 5 for connecting the chip 2 secured to the stage 1 to a lead 4 is bonded. In this manner, a problem in which a crack occurs in the chip 2 for constituting a semiconductor device to be manufactured by using the frame in the case of a thermal cycle test, can be avoided.</p> |
