| 摘要 |
<p>PURPOSE:To enable a semiconductor device provided with a surface mounting type package such as a shrink type TSOP.IC or the like not only to be protected against soldering failure at surface mounting but also to be enhanced in solder bonding strength after surface mounting. CONSTITUTION:In a method of mounting a semiconductor device provided with a surface mounting type package, cream solder 16 is applied to each outer lead 10, whereby the cream solder 16 is melted by heating and spontaneously fed to a contact area between the outer lead 10 and a land 22 when a solder reflow treatment is carried out, so that the outer lead 10 can be put in a state adapted to soldering and in result the semiconductor device can be not only protected against imperfect soldering but also enhanced in solder bonding strength.</p> |
