发明名称 |
Cooling structure of a test head for IC tester |
摘要 |
There is disclosed a cooling structure of a test head for IC tester capable of effectively cooling ICs mounted on printed boards. The ICs can be cooled by providing a hinge between the printed boards disposed around a pipe, retaining cooling plates having a conduit by the hinge and flowing fluid having a large specific heat such as water into the conduit.
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申请公布号 |
US5153815(A) |
申请公布日期 |
1992.10.06 |
申请号 |
US19900632335 |
申请日期 |
1990.12.21 |
申请人 |
ANDO ELECTRIC CO., LTD. |
发明人 |
SUZUKI, SHINYA;HIROSE, SEIICHI |
分类号 |
G12B15/02;G01R31/26;H01L21/66;H01L23/473;H05K7/20 |
主分类号 |
G12B15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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