| 摘要 |
<p>PURPOSE:To avoid the development of a defective connection by connecting leads to electrode pads without fail by thermal pressure fixing step doing no damage to the circuit formation region of a semiconductor pellet at all. CONSTITUTION:Insulating films 2 with both side bonding agents 21a, 21b bonded thereto are bond-fixed onto the parts along the two sides on the surface of the semiconductor pellet 1. Next, respective leads 3 are bond-fixed onto the semiconductor pellet 1 through the intermediary of the insulating film 2. Simultaneously with these steps, respective electrode pads 11 and the respective leads 3 of the semiconductor pellet 1 are respectively and correspondingly connected by thermal-pressure fixing step.</p> |
