| 摘要 |
<p>PURPOSE:To minimize the warp of a substrate due to a difference in thermal expansion factor which is caused by heating during die bonding and wire bonding by dividing the bonding support part of the substrate in blocks like a long strip of paper in the peripheral direction of die pad. CONSTITUTION:The bonding support part 28a of a substrate 28 is divided in blocks 28B like a long strip of paper in the peripheral direction of a die pad 25. An LSI chip 23 is mounted on a two-tier table carrier 22, this carrier 22 is heated and the LSI chip 23 is fixed under pressure on the die pad 25 through a die bonding agent 31. In addition, when wire bonding is performed, deformation or warp are defined to the interior 28B of the block 28B, if the deformation or warp is about to occur due to the difference in thermal expansion factor among the die pad 25, the copper foil of a lead electrode 26 and the polyimide resin of the bonding support part 28a. Thus the significant warp of the bonding support part 28a is prevented, the imperfect contact of a lead electrode 26 is eliminated and the significant improvement of productivity is ensured.</p> |
