MOUNTING AND COOLING SYSTEM OF ELECTRONIC ELEMENT

摘要

PURPOSE: To reduce heat conduction from a chip to a superconductor by distributing electric power to not less than one semiconductor logic chips dipped in liquid nitrogen together with a board having more than one superconductive power planes by using one board each for a necessary potential level. CONSTITUTION: An interconnection board 10 has many power planes enough for the presence of a necessary voltage level needed for logic chips 14 fitted to the interconnection board. The critical superconduction temperature Tc of superconductive materials of the power planes of the interconnection board 10 is higher than 77 deg.K. To maintain this temperature, a surrounding plate 16 for cooling covers the chips 14 and interconnection board 10. A nitrogen cooler 18 supplies liquid nitrogen of 70 deg.K to the surrounding plate 16 through a conduit 20 connected to the entrance 22 of the surrounding board 16 to hold the superconductive power planes at the critical superconduction temperature.