| 摘要 |
The invention relates to epoxy resin mixtures containing A. an epoxy resin of high functionality, B. a bisphenol F epoxy resin of low functionality, C. optionally an epoxy resin of low functionality and low molecular weight, D. an N-containing curing agent, E. optionally an accelerator, F. optionally a rubber and G. optionally a temperature-resistant thermoplastic. i |
