MANUFACTURE OF RESIN SEALING TYPE SEMICONDUCTOR DEVICE,申请号JP19910119606-传众专利搜索

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发明名称	MANUFACTURE OF RESIN SEALING TYPE SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH04274354(A)	申请公布日期	1992.09.30
申请号	JP19910119606	申请日期	1991.02.28
申请人	SHINDENGEN ELECTRIC MFG CO LTD	发明人	FURUSATO KOJI
分类号	H01L23/50	主分类号	H01L23/50
代理机构		代理人
主权项
地址

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