| 摘要 |
PURPOSE:To facilitate position control of sealing resin while preventing an interelectrode short circuit at the time of wirebonding. CONSTITUTION:A wiring substrate 1 having a recessed part structure 5 of a loading part of a semiconductor chip 2 is integrally formed. A metal plating part 7 for mounting a semiconductor chip at the recessed part 5 is lower set up than the other metal plating part 6 to be wirebonded. |
