Integrated circuit chip package.

摘要

An integrated circuit chip package comprises a first ceramic substrate 1 having integrated circuit chips 2 thereon and a second printed circuit card substrate 7 electrically connected to the substrate 1 and having signal input/output connections 3 for the chips 2 located at edges thereof. Conductive power planes 5 are separated from the signal input/output connections 3 and removably connected to the substrate 7 by an area array power connector 4. Power is provided from a power source 21 to the power planes 5 and thence through flexible signal connectors 13 to the connections 3.