发明名称 WIRE BONDING METHOD AND DEVICE THEREOF
摘要 PURPOSE:To protect the surface of a metal small gauge wire from damage by allowing a capillary to move freely even at any angle when moving said capillary to a second wire bonding site after having wire-bonded a first wire bonding site. CONSTITUTION:There are provided a metal small-gauge wire 3 made of gold, aluminum or the like and a capillary tool 4 having a hollow hole, which guides the metal small-gauge wire 3. After having wire-bonded a first wire bonding site, the capillary tool 4 is carried to a second wire bonding site. The capillary tool 4 is moved on the slant at a specified angle in parallel to a transfer direction. At the second bonding wire site, the capillary is posture-converted to the initial state and wire-bonded. This construction makes it possible to protect the surface of the metal small-wire gauge from damage by a corner section of a metal small-gauge wire take out port of the capillary tool 4.
申请公布号 JPH04273136(A) 申请公布日期 1992.09.29
申请号 JP19910058054 申请日期 1991.02.27
申请人 OKI ELECTRIC IND CO LTD 发明人 OKUAKI YUTAKA
分类号 H01L21/60 主分类号 H01L21/60
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