| 摘要 |
An apparatus for testing IC elements each having an upper mold and leads includes a holding section for holding the IC elements, a contact section having contact to be contacted with the leads of the IC elements and a supporting member for supporting the probes, a lift mechanism for causing the holding section and the contact section to approach each other and contact them each other, and a mold guide provided adjacent the supporting member and movable toward it. The mold guide includes an edge portion formed with grooves for receiving the probes, and a bottom face and inner faces for aligning the IC elements with the mold guide.
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