发明名称 |
Die attachment method for use in high density interconnected assemblies |
摘要 |
A method for grounding or electrically biasing an integrated circuit chip without using a conductive die attach material comprises affixing the chips to a substrate using a thermoplastic polyimide adhesive. A metallization layer electrically connects the sides of the chips, which act as grounding surfaces, to a biased or grounded conductive layer on the substrate. The top surfaces of the integrated circuit chips which include the interconnection pads are protected against undesired metallization by a removable protective layer while the metallization layer is applied. Metal electroplated on the metallization layer serves the functions of a heat sink for the chip and a ground plane between chips.
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申请公布号 |
US5151776(A) |
申请公布日期 |
1992.09.29 |
申请号 |
US19910671612 |
申请日期 |
1991.03.19 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
WOJNAROWSKI, ROBERT J.;EICHELBERGER, CHARLES W. |
分类号 |
H01L21/58;H01L21/60;H01L23/538 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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