| 摘要 |
PURPOSE:To provide a semiconductor device capable of making a connection between electrodes of a semiconductor element and between semiconductor elements in the same package to the utmost. CONSTITUTION:Electrodes of 2 IC chips 12a, 12b are connected with a drawing- out lead 16a and a drawing-round lead 16b5 which are patternized on a film 14. In a wiring pattern of a lead, a wiring of drawing-round leads 16b1 and 16b4, 16b2 and 16b3, in which a connection cannot be made, is connected between pads 24b1 and 24b4, 24b2 and 24b3 formed in respective drawing-round leads by using bonding wires 18, 18. |
