| 摘要 |
PURPOSE:To obtain a semiconductor device which can comply with a power device with a power supply capacity in small module structure. CONSTITUTION:A board for a semiconductor device is divided into one for a power circuit service and the other for a control circuit service. A copper foil ceramic board 7 having high thermal conductivity is adopted for the power circuit board while an aluminum insulation board 8 proper to the formation of a sophisticated conductor pattern is adopted for the control circuit board. A power chip 2 is mounted on the board 7 while an electronic component 3, which constitutes the control circuit, is mounted on the board 8. The circuits between the board 7 and the board 8 are connected with a bonding wire 9. This construction makes it possible to maintain high dissipation properties for the power chip 2 whose thermal loss is marked, and mount a sophisticated control circuit on a small-sized with higher density. |
