| 摘要 |
POST-PRESS HEAT TREATMENT PROCESS FOR IMPROVING THE DIMENSIONAL STABILITY OF A WAFERBOARD PANEL There is provided a process for improving the thickness swelling properties of a manufactured waferboard panel. The process is based on the discovery that a correlative relationship exists between the relative thickness swelling properties versus the parametric properties of time and temperature. Thus the process involves subjecting the manufactured board to a post-heat treatment at a predetermined temperature for a predetermined time in order to obtain the desired percentage reduction in thickness swelling. |
