发明名称 |
Method for producing a package-type semiconductor assembly |
摘要 |
In production of a closed package-type semiconductor assembly provided with a built-in semiconductor element and conductive leads for connection to outside devices, a conductive island, the conductive leads and other accessories are united together by one stage moulding of molten glass. Simple process reduces the production cost greatly and no use of dusty ceramic components much raises functional reliability of the product. |
申请公布号 |
US5151118(A) |
申请公布日期 |
1992.09.29 |
申请号 |
US19910769770 |
申请日期 |
1991.10.04 |
申请人 |
KABUSHIKI KAISHA GOTO SEISAKUSHO |
发明人 |
HIRAKAWA, TADAO;TAMURA, SACHIO;SASANAMI, HIROMITSU |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|