MANUFACTURE OF SEMICONDUCTOR DEVICE AND LEAD FRAME

摘要

PURPOSE:To facilitate assembly of a fine pitch plastic IC without generation of short-circuit between outer leads by providing a process of making larger the width of outer lead than that at the time of mounting and then removing the plated layer of the surfaces facing with each other of the adjacent outer leads. CONSTITUTION:The width of outer leads not yet solder-plated is set larger than the specified width A by the cutting allowance A'. A solder-plated layer 4 is formed on the entire surface of this outer lead 2' and the outer lead 2 having the specified width A can be formed by cutting both side surface of the outer lead 2''. Thereafter, the outer lead 2 is mounted on a printed wiring board by the ordinary method. As a result, short-circuit between the outer leads and between the pins can be prevented.