发明名称 |
Semiconductor strain sensor and manufacturing method thereof |
摘要 |
A semiconductor strain sensor having a stem with a lead hole in which a lead terminal is installed and electrically coupled to an external circuit. A sensor chip having piezo-resistors to a bride circuit is joined with a front surface of the stem. A shell is joined with the front surface of the stem by projection welding after the back surface of the stem is flattened to within a predetermined limit. A space formed by the shell and stem is filled with a damping liquid. The stem is integrally coupled to the sensor chip through an adhesive, and spacers are added to the adhesive to keep the thickness of the adhesive to a predetermined value. This arrangement can effectively prevent propagation of the welding strain of the stem from adversely affecting the sensor chip.
|
申请公布号 |
US5150616(A) |
申请公布日期 |
1992.09.29 |
申请号 |
US19900575526 |
申请日期 |
1990.08.31 |
申请人 |
NIPPONDENSO CO., LTD. |
发明人 |
KONDO, MUNENARI;IMAI, MASAHITO;NARITA, RYOICHI;MAEDA, TAKUSHI |
分类号 |
G01P15/02;G01P1/02;G01P15/08;G01P15/09 |
主分类号 |
G01P15/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|