发明名称 WIRE BONDING
摘要 PURPOSE:To strengthen the pressure at the cutting point of a wire by oscillating the fulcrum of an arm for driving the bonding wedge centered on the position at which the tip of the wedge becomes parallel to a substrate. CONSTITUTION:As the fulcrum D'' of an arm for driving a wedge is set on the left below the position D at which the tip of the wedge becomes parallel to a substrate, the pressure on the right below the tip 6 is large while small on the left therebelow. As the tip it flat, a wire is easy to cut at the point E on the right below the tip. After fused, the wire is cut at the point E when it is clamped and pulled. This ensures a certain bonding strength while makes the wire easy to cut on the intensely pressed side.
申请公布号 JPS56103436(A) 申请公布日期 1981.08.18
申请号 JP19800006002 申请日期 1980.01.22
申请人 FUJITSU LTD 发明人 MIYAJIMA EIJI
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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