发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To form an ideal wire loop and to prevent a wire from being damaged by a method wherein a reversing action is set as an arc action whose center is situated at a wire neck part or near the wire neck part at a first bonding point. CONSTITUTION:Tn a state that a clamper which clamps a wire 1 is opened, the wire 1 is connected to a first bonding point A; after that, a capillary 2 is raised up to a point B. After the capillary has been stopped once or instantaneously at the point B, the capillary 2 executes a reversing action as an arc action at a radius of R whose center is situated at a wire neck part 1a or near the wire neck part 1a; the capillary is then moved to a point C. Since the reversing action is set as the arc action whose center is situated at the wire neck part la or near the wire neck part 1a, the capillary 2 does not trail the wire 1. Thereby, an ideal wire loop is formed, the capillary 2 does not trail the wire 1 and the wire is not damaged.
申请公布号 JPH04273134(A) 申请公布日期 1992.09.29
申请号 JP19910053700 申请日期 1991.02.27
申请人 SHINKAWA LTD 发明人 TERAKADO YOSHIMITSU;YAMAZAKI NOBUHITO
分类号 H01L21/60;B23K20/00 主分类号 H01L21/60
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