| 摘要 |
PURPOSE:To optimumly execute conditioning in a reflow corresponding to the difference of a heat capacity in parts mounted on a substrate in a heat conductive reflow soldering device. CONSTITUTION:Heater block 11 for preheating, heater block 12 for reflow, heater block 21 for adjusting cooling speed of the substrate and block 13 for cooling the substrate are arranged. The heater block 12 for reflow is finely divided into three heater blocks 12a, 12b, 12c which are capable of controlling temps. While conveying the parts-mounted substrate P with an endless belt 16 disposed between pulleys 14, 15, the substrate P is heated with the heater blocks 11, 12 through the conveying belt 16. On the heater block 12 for reflow, solder paste applied between the substrate and the mounted parts, is melted. According to the heat capacity of mounted parts, to one or two of finely divided heater blocks 12a, 12b, 12c energizing is turned off or the setting temp. is individually set low. |
