发明名称 SOLDERING APPARATUS
摘要 PURPOSE:To provide a VPS soldering apparatus having structure using single heating solvent and preventing the solvent from disappearing with gasifying. CONSTITUTION:A heating chamber 11 constituted so as to mount a material to be treated on a carrier 1, pass this through a first cooling chamber 10 having inlet with a first shutter 13 and communicating with a heating chamber 11 with a second shutter 14, and communicate with a second cooling chamber 12 with the second shutter 14 and a third shutter 15, provides a heater 4 and carbon fluoride 5 at the bottom part. After executing the soldering by hanging down the material to be treated mounted on the carrier 1 into vapor of the solvent 5 formed with heating of a heater 4, the carrier 1 is pulled up and conveyed to the second cooling chamber 12 and the cooled material to be treated is carried out to the outer part from a fourth shutter 16.
申请公布号 JPH04270064(A) 申请公布日期 1992.09.25
申请号 JP19910026527 申请日期 1991.02.20
申请人 FUJITSU LTD 发明人 YONEDA YOSHIHIRO
分类号 B23K1/00;B23K1/015;B23K101/42;H05K3/34 主分类号 B23K1/00
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