| 摘要 |
<p>PURPOSE:To prevent generation of dip-drips on the lead-out base part of a lead wire when an outer covering of insulative coating material is provided on the circumferential surface of an electronic component. CONSTITUTION:On the base electronic component, on which a pair of lead wires 3 are soldered by lining up the outlet direction of lead wires to a disc-like chip 1 on which an electrode face 2 is given to both surfaces, a mask, such as shielding frame 4 or an adhesive tape and the like, is provided covering the circumference of the base part of the lead wire 3 led out from the chip 1. When the chip 1 is dipped in dip-coating material for coating utilizing the masking effect of the above-mentioned masking, the generation of drips of dipping on the base of the lead out part of the lead wire 3. As a result, the lead wire and a printed wiring board can be soldered properly in the state wherein the electronic component is lead-mounted on the printed wiring board.</p> |
