| 摘要 |
Curable epoxy resin mixtures containing (a) from 30 to 70 parts by weight of a tetraglycidyl compound of the formula I <IMAGE> in which R1, R2, R3 and R4, independently of one another, are each a hydrogen atom, a halogen atom or C1-C4-alkyl, at least one of the substituents R1 to R4 being C1-C4-alkyl, and (b) from 70 to 30 parts by weight of an aromatic glycidyl ether containing on average from 2.0 to 3.0 glycidyl ether groups in the molecule, where (a) and (b) together are 100 parts by weight, (c) a diaminodiphenyl sulphone in such an amount that from 0.6 to 1.3 equivalents of amine hydrogen are present per epoxide equivalent of the epoxy resin component from (a) and (b), and (d) from 1 to 50 parts by weight, based on 100 parts by weight of (a) and (b), of a thermoplastic, dissolved therein, having a glass transition temperature of at least 150 DEG C, are suitable for the production of cured moulded materials, in particular for the production of prepregs for fibre-reinforced composite materials. |
