发明名称 DEVICE FOR FEEDING SEMICONDUCTOR ELEMENT PIECE BY PIECE
摘要 PURPOSE:To feed accurately the semiconductor element piece by piece by providing the first stopper spring making contact with the second element consecutive to the semiconductor element stopped by the stopper of an oblique chute and the second stopper spring making contact with the element consecutive to the second element. CONSTITUTION:The semiconductor element dropped by its own weight leftwardly of the oblique chute 1 is received by the stopper 6, the first stopper spring 12 formed of elastic member is brought into contact with the side surface of the second element 3, and the second stopper spring 15 formed of elastic material is brought into contact with the side surface of the element 5 consecutive to the second element. When the element is newly dropped, a protective plate 17 protects the second spring 15. Thus, the spring 12 urges the element 3 downwardly and the spring 15 urges the element 5 upwardly, and accordingly they can release the interference between the elements, and feed the element accurately piece by piece.
申请公布号 JPS56101755(A) 申请公布日期 1981.08.14
申请号 JP19800005055 申请日期 1980.01.19
申请人 TOKYO SEIMITSU CO LTD 发明人 YASUNAGA MASAAKI;TSUCHISHIMA JIROU
分类号 G01R31/26;H01L21/66;H05K13/02 主分类号 G01R31/26
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