发明名称 Soldering and holding PCB during soldering - holding PCB taut during soldering so that it cannot curve or bend under heat generated
摘要 Pcbs (12) with electronic components mounted on them are soldered such that the heat from soldering does not cause the pcb to bend. Holding fingers (13, 14) fixedly hold the pcb (12) in place. During the soldering process, pulling forces (P1, P2) are exerted on the pcb (12). These forces (p1, p2) act outwardly and parallel to the plane of the pcb (12). During soldering the pcb (12) is stretched so that it cannot bend. The holding fingers (13, 14) are pivotable on a frame (10) and engage in corresponding holes (25) in the pcb (12). ADVANTAGE - Pcb cannot curve or bend due to heat from soldering making it difficult or impossible to insert pcb into device later.
申请公布号 DE4108846(A1) 申请公布日期 1992.09.24
申请号 DE19914108846 申请日期 1991.03.18
申请人 ROBERT BOSCH GMBH, 7000 STUTTGART, DE 发明人 FARKAS, ANTAL;ZABEL, GUENTER, 1000 BERLIN, DE
分类号 B23K3/06;H05K13/00 主分类号 B23K3/06
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