| 发明名称 |
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| 摘要 |
A package for heat dissipation of electronic components (10) mounted on a strip of thermally conductive material (12). A plastic body (20) is molded to encapsulate the component (10) and strip (12) with extended mold ejector pins (30) employed to form a recess (22) such that access to the thermally conductive strip (12) is obtained. An external heat sink (26) is mounted onto the plastic body (20). A clip (28) or through bolt establishes thermal contact between the external heat sink (26) and the internal thermally conductive strip (12). |
| 申请公布号 |
JPH0459780(B2) |
申请公布日期 |
1992.09.24 |
| 申请号 |
JP19880094716 |
申请日期 |
1988.04.19 |
| 申请人 |
INTAANASHONARU BIJINESU MASHIINZU CORP |
发明人 |
DAGURASU WAARESU FUIRITSUPUSU JUNIA;UIRIAMU KAARORU WAADO |
| 分类号 |
H01L23/34;H01L23/36;H01L23/40 |
主分类号 |
H01L23/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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