| 摘要 |
PURPOSE:To make it possible to make freely the connection of pads for wiring use with inner leads by metal lead wires and to make it possible to make the design of the positions of the pads for wiring use reasonably and simply. CONSTITUTION:When-pads 6, 6a, 6b,... for wiring use on a semiconductor chip 1 are connected with inner leads 5a, 5b,... of a lead frame 2 by metal lead wires 4, a semiconductor device is constituted into a structure, wherein even if one of the wires 4 is laid across on other inner leads like a metal lead wire 4a, the connection of one of the pads with one of the inner leads can be made. Moreover, an insulating covered part 7 is provided on one part of each inner lead of the lead frame. |
